OUR CAPACITIES & CAPABILITIES
We are committed to delivering unparalleled solutions tailored to meet your unique requirements. Our capabilities and capacities are geared towards providing you with the utmost support, ensuring that we can fulfill your needs to the fullest extent possible.
- SMT lines handling over 140 million mounting points monthly.
- Solder paste printing and adhesive bond dispensing.
- Expertise in high precision fine-pitch I.C, QFP, BGA & CSP mounting.
- Fine-pitch placement capability for up to 0201 (0603) chips.
- PCB size handling up to 450 x 570mm.
- Utilization of lead-free soldering processes.
- Specialized in engineering and prototype builds.
- Proficient in complete box builds.
- BGA rework expertise.